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Size name:20x20mm 0.3mm(thick) Description: This Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk. CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the Laptop will not start after overheating. And this copper heat sink solve thermal problems caused by frequent crashes laptop, etc Feature: 1. Thermal Conductive coefficient: 400W/(m.K) 2. With this copper pad to greatly lower gpu temperatures, can be used for Graphics card, north bridge, CPU chips. 3. It can be applied to HP,Dell,Acer,Thinkpad and all alptop and computer heatsink solution! Note: Please cleaned surface of your chipsets and heatsink and be sure no rest compound in it. Please be sure you have painted the silicone grease when fix the heatsink. Please be more patient when do it. There is a gap of more than 2mm between the GPU and the cooling module. In this space, hardware manufacturers fills the gap with a piece of heat-conducting glue (blue) and conducts heat. However, due to the long working time under high temperature, the thermal conductivity of the glue will gradually lose due to its aging, this copper shims is an wonderful substitute for the gap.
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